PANJIT to Showcase Latest Power Semiconductor and Packaging Technologies at electronica Shanghai 2026

PANJIT is set to exhibit at electronica Shanghai 2026, driven by the dual core of "Automotive Electronics" and "AI Server" to outline a future blueprint of high-efficiency, high-reliability power electronics technology for the industry. In the automotive sector, PANJIT presents a comprehensive portfolio of 48V systems, automotive-grade protection devices, and advanced SiC solutions, covering key applications ranging from electronic power steering (EPS) and battery management systems (BMS) to powertrain and ADAS systems. To meet the high computing power challenges of AI servers, PANJIT is showcasing Wide SOA high-performance MOSFETs and high-density packaging designed for hot-swap applications, effectively preventing failure risks and significantly reducing operational losses. Furthermore, to intuitively demonstrate its technical strength, a dynamic testing area has been specially set up on-site. Through live instrument testing, engineers can witness the components' outstanding heat dissipation performance firsthand. Simultaneously, various advanced packaging samples—such as Full-Cu Clip, DSC (Dual-side cooling), and SWF (Side-Wettable Flanks)—will be on display, comprehensively showcasing PANJIT's innovative capabilities in driving smart mobility and advanced computing.

Booth Information

High reliability, high power density, and high-performance packaging are PANJIT's standout technological hallmarks at this exhibition. We sincerely invite industry professionals, partners, and engineers to visit our booth for in-depth discussions with our expert technical team.

• Booth: N5.810
• Venue: Shanghai New International Expo Centre (SNIEC)
• Date: July 1–3, 2026

Register for your free admission pass via the official exhibition link and add PANJIT to your show itinerary:
⮕ Visitor Registration
We look forward to connecting with you at electronica Shanghai 2026.